Detailed Explanation of Docker's Five Storage Driving Principles

Docker first adopted aufs as the file system. Thanks to the concept of aufs layering, multiple containers can share the same image. However, aufs is not incorporated into the Linux kernel and only supports Ubuntu. In consideration of compatibility, storage drivers are introduced into docker version 0.7. At present, docker supports five storage drivers: aufs, Btrfs, device mapper, overlayfs and ZFS. As stated on docker's official website, there is no single driver suitable for all application scenarios. Only by selecting the appropriate storage driver according to different scenarios can docker's performance be effectively improved. How to select a suitable storage driver needs to understand the storage driver principle before making a better judgment. This paper introduces the detailed explanation of the five storage driver principles of docker and the comparison of application scenarios and IO performance tests. Before talking about the principle, let's talk about the two technologies of write time replication and write time allocation.

Copy on write (cow)

The technology used by all drivers - copy on write (cow). Cow is copy on write, which means to copy only when writing is needed. This is a modification scenario for existing files. For example, if multiple containers are started based on an image, if each container is allocated a file system with the same image, it will occupy a lot of disk space. Cow technology allows all containers to share the file system of the image, and all data is read from the image. Only when the file is to be written, the file to be written is copied from the image to its own file system for modification. Therefore, no matter how many containers share the same image, the write operation is performed on the replica copied from the image to their own file system, and the source file of the image will not be modified. If multiple containers operate on the same file, a replica will be generated in the file system of each container. What each container modifies is its own replica and isolated from each other, They don't affect each other. Using cow can effectively improve disk utilization.

Allocate on demand

Write time allocation is used in scenarios where there is no such file. Space is allocated only when a new file is to be written, which can improve the utilization of storage resources. For example, starting a container does not pre allocate some disk space for the container, but allocates new space as needed when a new file is written.

AUFS

Aufs (another union FS) is a union FS, which is a file level storage driver. Aufs can transparently cover the layered file system of one or more existing file systems, and merge multiple layers into a single-layer representation of the file system. Simply put, it supports mounting different directories to the file system under the same virtual file system. This file system can overlay and modify files layer by layer. No matter how many layers below are read-only, only the top file system is writable. When a file needs to be modified, aufs creates a copy of the file, uses cow to copy the file from the read-only layer to the writable layer for modification, and the results are also saved in the writable layer. In docker, the lower read-only layer is image, and the writable layer is container. The structure is shown in the figure below:

Overlay

Overlay is supported by Linux kernel after 3.18. It is also a kind of union FS. Unlike aufs, overlay has only two layers: an upper file system and a lower file system, representing the image layer and container layer of docker respectively. When a file needs to be modified, use cow to copy the file from the read-only lower to the writable upper for modification, and the results are also saved in the lower layer. In docker, the lower read-only layer is image, and the writable layer is container. The structure is shown in the figure below:

Device mapper

Device mapper is supported by Linux kernel after 2.6.9. It provides a mapping framework mechanism from logical devices to physical devices. Under this mechanism, users can easily formulate and implement storage resource management strategies according to their own needs. Aufs and overlayfs mentioned earlier are file level storage, while device mapper is block level storage. All operations are direct operations on blocks, not files. The device mapper driver will first create a resource pool on the block device, and then create a basic device with a file system on the resource pool. All images are snapshots of the basic device, and the container is a snapshot of the image. Therefore, the file system in the container is a snapshot of the file system of the basic device in the resource pool, and there is no space allocated for the container. When a new file is to be written, a new block is allocated in the container's image and data is written. This is called time allocation. When you want to modify an existing file, use cow to allocate block space for the container snapshot, copy the data to be modified to a new block in the container snapshot, and then modify it. The device mapper driver will create a 100g file by default, including images and containers. Each container is limited to 10g volumes and can be configured and adjusted by itself. The structure is shown in the figure below:

Btrfs

Btrfs is called the next generation write time copy file system and incorporated into the Linux kernel. It is also a file level storage, but it can directly operate the underlying device like device mapper. Btrfs configures a part of the file system as a complete sub file system, which is called subvolume. With subvolume, a large file system can be divided into multiple sub file systems. These sub file systems share the underlying device space and allocate it from the underlying device when disk space is needed, just like an application calling malloc () to allocate memory. In order to make flexible use of the device space, Btrfs divides the disk space into multiple chunks. Each chunk can use different disk space allocation policies. For example, some chunks only store metadata, and some chunks only store data. This model has many advantages. For example, Btrfs supports dynamic addition of devices. After adding a new disk to the system, you can use the Btrfs command to add the device to the file system. Btrfs regards a large file system as a resource pool and configures it into multiple complete sub file systems. It can also add new sub file systems to the resource pool. The basic image is the snapshot of the sub file system. Each sub image and container has its own snapshot, and these snapshots are the snapshots of subvolume.

When a new file is written, a new data block is allocated in the snapshot of the container. The file is written in this space, which is called time allocation. When you want to modify an existing file, use cow copy to allocate a new original data and snapshot, change the data in the newly allocated space, and then update the relevant data structure to point to the new sub file system and snapshot. The original original data and snapshot have no pointer and are overwritten.

ZFS

ZFS file system is a revolutionary new file system. It fundamentally changes the management mode of file system. ZFS completely abandons "volume management" and no longer creates virtual volumes. Instead, it centralizes all devices into one storage pool for management and uses the concept of "storage pool" to manage physical storage space. In the past, file systems were built on physical devices. In order to manage these physical devices and provide redundancy for data, the concept of "volume management" provides a single device image. ZFS is created on a virtual storage pool called "zpools". Each storage pool consists of several virtual devices (vdevs). These virtual devices can be raw disks, a RAID1 mirror device, or multi disk groups with non-standard RAID levels. The file system on zpool can then use the total storage capacity of these virtual devices.

Let's take a look at the use of ZFS in docker. First, a ZFS file system is allocated from zpool to the basic layer of the image, while other image layers are clones of the ZFS file system snapshot. The snapshot is read-only and the clone is writable. When the container is started, a writable layer is generated at the top level of the image. As shown in the figure below:

When you want to write a new file, use on-demand allocation. A new data is quickly generated from zpool, the new data is written to this block, and the new space is stored in the container (ZFS clone).

When you want to modify an existing file, use copy on write to allocate a new space and copy the original data to the new space to complete the modification.

AUFS VS Overlay

Both aufs and overlay are federated file systems, but aufs has multiple layers, while overlay has only two layers. Therefore, when copying on write, if the file is large and there are lower layers, Ausf may be slower. Moreover, overlay is incorporated into the Linux kernel mainline, and aufs does not, so it may be faster than aufs. However, overlay is still too young and should be used cautiously in production. As the first storage driver of docker, aufs has a long history, is relatively stable, has been practiced in a large number of production, and has strong community support. Currently, open source DC / OS specifies to use overlay.

Overlay VS Device mapper

Overlay is a file level storage and device mapper is a block level storage. When a file is very large and the modified content is very small, overlay will copy the whole file regardless of the modified content size. Modifying and displaying a large file takes more time than a small file, while block level only copies the blocks that need to be modified, not the whole file, In this scenario, device mapper is obviously faster. Because the block level directly accesses the logical disk, it is suitable for IO intensive scenarios. The performance of overlay is relatively stronger in the scenario of complex internal program, large concurrency but less io.

Device mapper VS Btrfs Driver VS ZFS

Both device mapper and Btrfs operate directly on blocks and do not support shared storage, which means that when multiple containers read the same file, they need to live multiple copies, so this storage driver is not suitable for use on the PAAS platform of high-density containers. Moreover, when many containers are started and stopped, it may lead to disk overflow and make the host unable to work. Device mapper is not recommended for use in production. Btrfs can be very efficient in docker build.

ZFS was originally designed for salaris servers with a large amount of memory. It will affect the memory when used. It is suitable for environments with large memory. ZFS cow makes the fragmentation problem more serious. For large files generated by sequential writing, if some of them are randomly changed in the future, the physical address of the file on the hard disk will no longer be continuous, and the performance of sequential reading will become poor in the future. ZFS supports multiple containers to share a cache block, which is suitable for PAAS and high-density user scenarios.

Test tool: iozone (a benchmark tool for file systems, which can test the read and write performance of file systems in different operating systems).

Test scenario: sequential and random IO performance from 4K to 1g files.

Test method: start the container based on different storage drivers, install iozone in the container, and execute the command:.

Definition and interpretation of test items

Write: tests the performance of writing to a new file.

Re write: test the performance of writing to an existing file.

Read: test the performance of reading an existing file.

Re read: test the validity of reading a recently read file

Detailed Explanation of Docker's Five Storage Driving Principles 1

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Moreover, compared with metal mesh, nano silver material has smaller radius of curvature and small resistance change rate during bending. In addition, due to the linewidth, it is more suitable for high-resolution close-up scenes such as mobile phones, smart watches and bracelets."By comprehensive comparison, I think nano silver has more advantages than metal grid," Huang Hanfeng said.Flexible cover plateIn order to bend at will, in addition to solving the flexible display and flexible touch, the last and most critical part is the flexible cover plate and fitting. However, due to its hard and fragile characteristics, glass cover plate is not the best choice in the field of flexibility.Huang Hanfeng said that compared with glass, pet and PI (polyimide) materials with high surface hardness and high light transmittance are better choices, but at present, pet and PI also have many problems to be solved. On the one hand, they are not resistant to high temperature and have poor light transmittance: pet and PI will have problems of partial melting and property change at low ambient temperature, and they do not have good light transmittance compared with glass.Secondly, it is difficult to achieve a balance between hardness and folding. Huang Hanfeng said that if you want to meet certain hardness requirements, you need to apply the hardened layer, but after coating the hardened layer, after repeated folding, the hardened layer will crack and reduce the hardness. Therefore, how to achieve a balance between the two is the biggest bottleneck at present.Compared with the flexible cover plate that needs further development, the 3D glass cover plate necessary for curved screen mobile phones has a very good development prospect.Some data show that 2018 may become the outbreak year of 3D glass cover plate. It is expected that the mobile phone penetration rate of 3D glass cover plate will exceed 50% around 2020. With the maturity of 3D glass cover plate processing technology and the decline of unit price, the penetration rate will further improve. It is expected that the market scale will reach more than 19 billion yuan in the future.Huang Hanfeng said that the common manufacturing processes of 1R (single radian bending) and 2R cover plates have been basically mature. They basically achieve a bending effect through hot bending technology. The difference is mainly in the coating of hardened layer. However, the yield is a problem to be solved, which is basically only 30%, and there is no room for improvement in the short term. If 4R is to be done in the future, the yield will be lower. Therefore, the yield is one of the urgent problems to be solved in the manufacture of cover plate.Flexible fitAfter the cover plate is selected, it is fitted, that is, the cover plate is integrated with the touch and display layer below to form a complete module. At present, there are two common methods: roller type and vacuum bonding: the roller has high efficiency and needs to roll the pasted object. The efficiency of vacuum type is relatively low, but it does not need to roll the pasted object, so it is not easy to cause damage to the pasted object.Huang Hanfeng said that if the curvature is large, you can only choose vacuum bonding. However, for the possible 4R bonding in the future, due to its special four side bending characteristics, it is difficult to avoid wrinkles and bubbles in places with large radians even if vacuum is adopted. At present, the industry has adopted customized extrusion airbags or plastic parts to alleviate this problem, but it has not been completely solved. Therefore, the industry still has room for progress in multi surface and high curvature fitting technology.Huang Hanfeng frankly said: "from the perspective of the supply chain, it will take several years for the flexible screen to really realize mass production. At the same time, it also needs the upstream and downstream supply chain to jointly overcome the relevant technical problems."For future development, Huang Hanfeng believes that the integration of various modules will be the general trend. He said: "in the incell technology of LCD, ITO touch film and liquid crystal layer are integrated together, which is a good integration. Now the fingerprint module is independent, and it can also be integrated with touch in the future. I think there will be a process of mutual integration and progress between functional modules in the future."
LG Will Mass Produce Mobile Phone Flexible Screen in the Fourth Quarter of This Year
LG Will Mass Produce Mobile Phone Flexible Screen in the Fourth Quarter of This Year
In the early morning of June 20, Beijing time, according to the English version of Korea Times, in order to further consolidate the leading position in the display market, LG display will mass produce a new version of smart phone flexible display from the fourth quarter of this year and provide it to major customers.LG researchers and technicians said that the purpose of producing flexible display is to meet the growing demand for innovative solutions. LG spokesman Frank Lee said that the company is trying to meet the rapidly growing market demand for advanced display screens. Li stressed that the new display screen is foldable and not fragile, and the product will become a major innovation in display technology.LG said it was investing in flexible displays and high-tech panels for mobile devices, namely OLED panels that support high-definition (UHD) displays. "We have completed the development of the first flexible display and will start mass production from the fourth quarter of this year," LG said in a statementThe E2 production line of the company's display manufacturing plant in pozhou, South Korea, will be responsible for the production of flexible displays. LG said that the OLED flexible display will adopt generation 4.5 glass cutting technology, and the monthly production capacity of the production line will be 12000 pieces.Koo Bon moo, chairman of LG, hopes to revive the enterprise by launching leading products. Therefore, as a major shareholder of LG display, LG Electronics will launch its first flexible display smartphone later this year.LG predicts that flexible display may become the latest trend of mobile devices, so the company may also consider selling flexible display to major mobile device manufacturers.It is reported that LG's competitor Samsung display is also developing similar products. At present, Samsung display is testing flexible display products to improve product quality. Due to manufacturing problems, the upcoming Galaxy note 3 should not be configured with a flexible display in the short term.Kim Yang Jae, an analyst at Woori investment securities in Korea, said: "mobile phone manufacturers are increasingly pursuing bright images, beautiful shapes and thin display screens, while flexible display screens cater to this demand. LG display is expected to help them seize a greater market share." Kim said, LG's strategy of switching to flexible display can break the industry conventions and make the company earn stable profits.In fact, flexible display is only one step for LG to invest in different businesses and seize the global market share of OLED. LG is the first company to mass produce OLED display and foldable OLED screen. At the same time, the company is also developing OLED TV supporting high-definition display.Lim Joo soo, manager of LG OLED Technology Strategy Department, said that in order to remain competitive, LG is trying to reduce costs, reduce power consumption and improve image quality. Lim Joo soo said: "LG display is developing high-definition OLED TV screen. In order to improve the brightness, we plan to replace the existing 'bottom light' technology with 'top light' technology. In addition, the company will develop new materials to extend the service life of OLED display."In the next few years, OLED TV will become the mainstream product, and LG plans to expand the TV screen size to 65 inches and 77 inches. LG said that the above two OLED displays will be produced by the M1 test production line of pozhou factory.
LG Will Mass Produce Mobile Phone Flexible Screen in the Fourth Quarter of This Year
LG Will Mass Produce Mobile Phone Flexible Screen in the Fourth Quarter of This Year
In the early morning of June 20, Beijing time, according to the English version of Korea Times, in order to further consolidate the leading position in the display market, LG display will mass produce a new version of smart phone flexible display from the fourth quarter of this year and provide it to major customers.LG researchers and technicians said that the purpose of producing flexible display is to meet the growing demand for innovative solutions. LG spokesman Frank Lee said that the company is trying to meet the rapidly growing market demand for advanced display screens. Li stressed that the new display screen is foldable and not fragile, and the product will become a major innovation in display technology.LG said it was investing in flexible displays and high-tech panels for mobile devices, namely OLED panels that support high-definition (UHD) displays. "We have completed the development of the first flexible display and will start mass production from the fourth quarter of this year," LG said in a statementThe E2 production line of the company's display manufacturing plant in pozhou, South Korea, will be responsible for the production of flexible displays. LG said that the OLED flexible display will adopt generation 4.5 glass cutting technology, and the monthly production capacity of the production line will be 12000 pieces.Koo Bon moo, chairman of LG, hopes to revive the enterprise by launching leading products. Therefore, as a major shareholder of LG display, LG Electronics will launch its first flexible display smartphone later this year.LG predicts that flexible display may become the latest trend of mobile devices, so the company may also consider selling flexible display to major mobile device manufacturers.It is reported that LG's competitor Samsung display is also developing similar products. At present, Samsung display is testing flexible display products to improve product quality. Due to manufacturing problems, the upcoming Galaxy note 3 should not be configured with a flexible display in the short term.Kim Yang Jae, an analyst at Woori investment securities in Korea, said: "mobile phone manufacturers are increasingly pursuing bright images, beautiful shapes and thin display screens, while flexible display screens cater to this demand. LG display is expected to help them seize a greater market share." Kim said, LG's strategy of switching to flexible display can break the industry conventions and make the company earn stable profits.In fact, flexible display is only one step for LG to invest in different businesses and seize the global market share of OLED. LG is the first company to mass produce OLED display and foldable OLED screen. At the same time, the company is also developing OLED TV supporting high-definition display.Lim Joo soo, manager of LG OLED Technology Strategy Department, said that in order to remain competitive, LG is trying to reduce costs, reduce power consumption and improve image quality. Lim Joo soo said: "LG display is developing high-definition OLED TV screen. In order to improve the brightness, we plan to replace the existing 'bottom light' technology with 'top light' technology. In addition, the company will develop new materials to extend the service life of OLED display."In the next few years, OLED TV will become the mainstream product, and LG plans to expand the TV screen size to 65 inches and 77 inches. LG said that the above two OLED displays will be produced by the M1 test production line of pozhou factory.
Design Scheme for Replacing Ch7511b DP to LVDS Screen
Design Scheme for Replacing Ch7511b DP to LVDS Screen
Ch7511b is a DP to LVDS screen conversion chip, and ch7511b is an EDP to LVDS conversion chip. Ch7511b converts the embedded DisplayPort signal to LVDS (low voltage differential signal). Through the advanced decoding / encoding algorithm of ch7511b, the input EDP high-speed serial video data can be seamlessly converted to LVDS. LVDS is a popular high-speed serial link display technology for medium / large LCD displays. This chip is specially designed for the multi-functional integrated PC, industrial computer and notebook computer market.Cs5211 is also an EDP to LVDS bridge chip. Cs5211 has flexible configuration and is suitable for various low-cost display systems. Cs5211 is compatible with EDP 1.2 and supports 1-channel and 2-channel modes. The speed of each channel is 1.62gbps and 2.7Gbps. Cs5211 adopts powerful SerDes technology, which can recover high-speed serial data with low bit error rate.Compared with ch7511b, the advantages of cs5211 in designing DP to LVDS conversion circuit are as follows:1. Cs5211 LVDS transmitter supports single port and dual port modes.2. The maximum resolution supported by cs5211 is WUXGA (1920x1200).3. Cs5211 has 4 configuration pins and can support 16 different combinations of panel resolution and LVDS working mode of an EEPROM image.4. Cs5211 provides a simple tool to edit, generate and update EEPROM images for custom configuration.5. Cs5211 has simple circuit design and fewer peripheral circuit components, which is more conducive to saving BOM cost.6. Cs5211 integrates clock source to save external crystal.7. Cs5211 supports a wide range of power supply (core power is 1.8 1.2V), saving on-board power supply equipment.8. The total power of cs5211 is less than 300MW, which simplifies the design of power supply network and is easy to integrate into the current popular low-cost display system.9. Cs5211 is qfn68 package and ch7511b is also qfn68 package. Overview: cs5211 directly replaces ch7511 without changing the circuit board and pin to pin replacement mode.10. Cs5211 on-chip MCU can update the program online to adjust various parameter values of the screen, improve the universality of the design and product compatibility, and increase the applicable scenario and development and design cost of the scheme product.The detailed characteristic parameters of cs5211 are as follows:Overview:1. 2-channel DisplayPort v1.1 compatible receiverSupports 18 bit single port, 18 Bit dual port, 24 bit single port and 24 bit dual port LVDS outputsSupports open LDI and spwg bit mapping for LVDS applicationsBuilt in oscillator without external crystalEmbedded linear voltage drop regulator (LDO)On Chip MCUSelect the support panel through the GPIO pin controlBoot ROM is loaded automatically after power onUpdate serial boot ROM data via I2C bus or auxiliary channelAutomatic chip power mode control.EMI reduction of EDP and LVDWide core power range from 1.8V to 1.2V.Qfn68 package.HBM 4KV2. DP receiver characteristics:Compliant with embedded display port (EDP) specification 1.2Support 1 or 2 main link channels at 1.62gbps or 2.7Gbps link rate.Enter the color depth of 18 / 24 bits per pixel in RGB format.Support enhanced frame mode.Support VESA and CEA timing standards, resolution up to 1920x1200, 60Hz, 24 bit per pixel mode.Supports dynamic refresh rate switching.Support quick link training and full link training.Support EDP authentication: optional scrambling seed reset and optional frame.Support HPD interrupt.3. LVDS output characteristics:Support 18 bit single port, 18 Bit dual port, 24 bit single port and 24 bit dual port LVDS output interfaces.Supports openldi and spwg bit mapping for LVDS applications.Keep LVDS output when the input video is not ready.Flexible LVDS output pin switching.Programmable swing / common mode voltage.Output conversion rate control to reduce electromagnetic interference.4. Output panel and backlight controlProgrammable LCD panel power sequenceTwo PWM modes are supported, including backlight brightness level control PWM pin and BLUP / bldn pinEditing: JQ
Design Scheme for Replacing Ch7511b DP to LVDS Screen
Design Scheme for Replacing Ch7511b DP to LVDS Screen
Ch7511b is a DP to LVDS screen conversion chip, and ch7511b is an EDP to LVDS conversion chip. Ch7511b converts the embedded DisplayPort signal to LVDS (low voltage differential signal). Through the advanced decoding / encoding algorithm of ch7511b, the input EDP high-speed serial video data can be seamlessly converted to LVDS. LVDS is a popular high-speed serial link display technology for medium / large LCD displays. This chip is specially designed for the multi-functional integrated PC, industrial computer and notebook computer market.Cs5211 is also an EDP to LVDS bridge chip. Cs5211 has flexible configuration and is suitable for various low-cost display systems. Cs5211 is compatible with EDP 1.2 and supports 1-channel and 2-channel modes. The speed of each channel is 1.62gbps and 2.7Gbps. Cs5211 adopts powerful SerDes technology, which can recover high-speed serial data with low bit error rate.Compared with ch7511b, the advantages of cs5211 in designing DP to LVDS conversion circuit are as follows:1. Cs5211 LVDS transmitter supports single port and dual port modes.2. The maximum resolution supported by cs5211 is WUXGA (1920x1200).3. Cs5211 has 4 configuration pins and can support 16 different combinations of panel resolution and LVDS working mode of an EEPROM image.4. Cs5211 provides a simple tool to edit, generate and update EEPROM images for custom configuration.5. Cs5211 has simple circuit design and fewer peripheral circuit components, which is more conducive to saving BOM cost.6. Cs5211 integrates clock source to save external crystal.7. Cs5211 supports a wide range of power supply (core power is 1.8 1.2V), saving on-board power supply equipment.8. The total power of cs5211 is less than 300MW, which simplifies the design of power supply network and is easy to integrate into the current popular low-cost display system.9. Cs5211 is qfn68 package and ch7511b is also qfn68 package. Overview: cs5211 directly replaces ch7511 without changing the circuit board and pin to pin replacement mode.10. Cs5211 on-chip MCU can update the program online to adjust various parameter values of the screen, improve the universality of the design and product compatibility, and increase the applicable scenario and development and design cost of the scheme product.The detailed characteristic parameters of cs5211 are as follows:Overview:1. 2-channel DisplayPort v1.1 compatible receiverSupports 18 bit single port, 18 Bit dual port, 24 bit single port and 24 bit dual port LVDS outputsSupports open LDI and spwg bit mapping for LVDS applicationsBuilt in oscillator without external crystalEmbedded linear voltage drop regulator (LDO)On Chip MCUSelect the support panel through the GPIO pin controlBoot ROM is loaded automatically after power onUpdate serial boot ROM data via I2C bus or auxiliary channelAutomatic chip power mode control.EMI reduction of EDP and LVDWide core power range from 1.8V to 1.2V.Qfn68 package.HBM 4KV2. DP receiver characteristics:Compliant with embedded display port (EDP) specification 1.2Support 1 or 2 main link channels at 1.62gbps or 2.7Gbps link rate.Enter the color depth of 18 / 24 bits per pixel in RGB format.Support enhanced frame mode.Support VESA and CEA timing standards, resolution up to 1920x1200, 60Hz, 24 bit per pixel mode.Supports dynamic refresh rate switching.Support quick link training and full link training.Support EDP authentication: optional scrambling seed reset and optional frame.Support HPD interrupt.3. LVDS output characteristics:Support 18 bit single port, 18 Bit dual port, 24 bit single port and 24 bit dual port LVDS output interfaces.Supports openldi and spwg bit mapping for LVDS applications.Keep LVDS output when the input video is not ready.Flexible LVDS output pin switching.Programmable swing / common mode voltage.Output conversion rate control to reduce electromagnetic interference.4. Output panel and backlight controlProgrammable LCD panel power sequenceTwo PWM modes are supported, including backlight brightness level control PWM pin and BLUP / bldn pinEditing: JQ
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