2 Miniaturized packaging trend of LED driver chips
With the rapid development of LED display screen industry in production technology, display screen manufacturers have been unable to use the past product high homogenization and price reduction competition strategy to obtain market share. In the face of various applications and market demand, such as ultra dense screen or rental screen, the design must be made to a higher standard in order to face the fierce market competition. It includes that the box structure shall be beautiful and the overall weight must be light and thin, which makes it easy for users to assemble and disassemble on site and saves assembly time; Even some manufacturers directly connect the data and power interfaces between the boxes without any wire connection between the boxes, so as to reduce the possibility of ash accumulation and reduce the occurrence of failure rate. Therefore, for the light and thin box design, the market has higher and higher requirements for the driving IC packaging technology. From the earliest SOP (accumulated product code is GF) packaging, SSOP (accumulated product code is GP) packaging and QFN packaging (accumulated product code is GFN), to mssop now (accumulated product code is GM) packaging, it can be found that the size lightness of LED driven IC is an inevitable trend, which also tests the ability of driving IC manufacturers in product design. They must expand their functions to the extreme in the limited chip area.
3 Why import GM (mssop package)? What are the advantages of GM package?
A. Advantages of GM (mssop) package replacing GP (SSOP) package
The lamp driven two-layer plate scheme reduces the total module manufacturing cost by 7%
As far as the current outdoor LED advertising screen market is concerned, the specification of P10 / 4 sweep is the mainstream. The use of GM encapsulated LED Driver IC, compared with the traditional GP encapsulated driver IC, can reduce the use of one layer of driver version; in addition, it can also be installed on one side, and it is not difficult to cut feet on the back, so as to simplify the overall production process and improve production capacity. The most important thing is to reduce the total cost of module production by 7%.
Small package area is favorable for PCB routing design
The packaging area of GM is 37% less than that of GP. Therefore, whether it is for the PCB design of LED display screen of plug-in lamp (DIP) or surface mount lamp (SMD), the layout is simpler and the number of board layers can be saved.
With the LED lamp, the luminous efficiency is improved and the optimum current value is matched
As mentioned above, the luminous efficiency of LED lamps has jumped, so the outdoor LED display can use a smaller current to achieve the same brightness as that used in the past. According to the current market experience, the application current of outdoor LED display mostly falls at 20mA 10%. For example, the maximum current of GM packaged products such as accumulated mbi5120, mbi5124 and mbi515x is mostly set at 20 25mA, which meets the mainstream demand of the market
Pin pin design is the same as GP packaging, simple import program
The pin pin function definition of GM package is exactly the same as that of GP package, so when converting the original GP package to GM package, it can be perfectly replaced only by slightly modifying the original PCB.
B. Advantages of GM (mssop) package replacing GFN (QFN) package
Improve the yield of LED display products and reduce the occurrence of false soldering and tin connection
When using QFN packaging, the common problem is that the pin pin pin, heat dissipation pad and PCB pad of QFN packaging are prone to false soldering or poor tin connection between adjacent pin pins, resulting in an increase in the defect rate. Relatively speaking, GM packaging has low requirements for SMT process, which helps to reduce the production defect rate and reduce the cost of customer complaints and customer service.
Patch speed increased by 10% and production capacity increased rapidly
GM packaging patch speed is 10% faster than QFN packaging speed, which helps to improve the overall production capacity.
Reduce the demand for high-tech manpower
GM packaging test and maintenance are easier than QFN, so it only needs ordinary technicians to operate, reduce high-end labor costs and make more efficient application of resources.
At present, GM (mssop) packaging has been on the market for about half a year. In view of the common questions during import, the following summarizes the relevant SMT experience for manufacturers to refer to during import and accelerate the import speed:
a. Confirm whether pcbpad has been oxidized, and clean it with cleaning agent before going online
b. If the PCB is not vacuum packed, it needs to be baked before going online
c. Confirm the mark point on the board edge
d. The board needs to pass AOI and X-ray
Steel mesh related
a. The recommended thickness is 0.12mm
b. Cleaning times: it is recommended to clean every 3 5 times after printing
a. BGA, CSP, QFP and other non vacuum packaging IC must be put into the oven for baking if the original packaging has been removed: 110 / - 5 24hr;
b. Confirm and check the mounting pressure
c. Before going online, the furnace temperature curve shall be obtained by using the furnace temperature plate
Miniaturization is the driving force for the design of all consumer electronic products, and consumer electronic products are developing in the direction of light, micro and. The world's first computer covers an area of 1500 square feet and weighs 30 tons. It has developed into the pad in its hands, "big brick" Portable mobile phones have developed to today's smart phones; in response to the design orientation of LED display screen and the overall market demand, we can see the phenomenon that GP (SSOP) packaging replaced GF (SOP) packaging in the past. Therefore, it can be boldly expected that GM (mssop) packaging will also replace most GP (SSOP) packaging.
The introduction of new GM packaging represents the improvement of LED display manufacturing process and also proves the progress in R & D capability. Whether GM packaging replaces GP packaging or QFN packaging, the quality of products can be improved. I believe that more and more GM use experience can make LED display manufacturing enter the next era.
Bao’an District Shenzhen City, China
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