What Are the Configurations of Notebook Power Adapter

Notebook power adapter, that is, the charger of notebook computer. It is a high-quality switching power supply. Its working principle is the same as that of switching power supply in color TV and other household appliances. Its function is to provide stable low-voltage DC for notebook computers (generally between 12 19v).Structure of notebook power adapter1. The function of varistor is that when the external voltage is too high, the resistance value of varistor decreases rapidly, and the fuse connected in series with varistor is blown, so as to protect other circuits from combustion and damage.

What Are the Configurations of Notebook Power Adapter 1

2. Fuse, specification 2.5a/250v. When the current in the circuit is too large, the fuse will blow to protect other components.3. The main function of inductance coil (also known as choke coil) is to reduce electromagnetic interference.4. Rectifier bridge, specification d3sb, function is to convert 220V AC to DC.

5. The filter capacitance is 180uf / 400V. Its function is to filter the AC ripple in the DC current and make the circuit work more reliable.6. Operational amplifier IC (integrated circuit), protection circuit and voltage regulation are important parts.7. The temperature probe is used to detect the internal temperature of the power adapter. When the temperature is higher than a set value (the temperature threshold of power adapters of different brands is slightly different), the protection circuit will cut off the voltage output of the adapter, so as to protect the adapter from damage.

8. High power switch is one of the core components of switching power supply. Switching power supply can work "on and off", and switching power supply plays an important role. such9. Switching transformer is one of the core components of switching power supply.10. The function of secondary rectifier is to convert low-voltage AC to low-voltage DC. In IBM's power adapter, the rectifier is usually operated by two high-power parallel connections to obtain a larger current output.

11. There are two secondary filter capacitors with specifications of 820uf / 25V, which can filter low-voltage DC ripple. In addition to the above components, the circuit board also has adjustable potentiometers and other resistance and capacitance elements.Maintenance of notebook power adapterBecause the power adapter is a switching power supply working under the state of high voltage and high current, the working load is relatively heavy, and it is a fully enclosed structure. There is no heat dissipation hole on the shell and no fan inside to assist heat dissipation, so the internal temperature of the power adapter is very high during operation. Especially in hot summer, you can feel hot by touching the surface, and the internal temperature is higher. Therefore, in daily office and entertainment, it should be properly maintained.

What Are the Configurations of Notebook Power Adapter 2

1. Create a good heat dissipation environment. When using the notebook in a high temperature environment, the power adapter should be placed in a ventilated place away from direct sunlight; Do not put the power adapter near the heat dissipation outlet of the notebook, otherwise not only the heat of the power adapter cannot be dissipated, but also absorb some heat. In hot summer, we can put the adapter on the side to increase the contact area between the adapter and the air, so as to better radiate the heat of the adapter. In order to obtain better heat dissipation effect, we can also pad a narrow plastic block or metal block between the adapter and the desktop to increase the air convection speed around the adapter and speed up the heat dissipation of the adapter.

2. In case of any abnormality, it shall be stopped in time. When the power adapter emits large working noise or even smoke, it is often damaged or faulty. It should be stopped immediately and can be put into use again after maintenance by professional engineers.3. Be careful when using non original power supply. The non original power adapter may have some differences in output interface, voltage and current values (or the nominal is inconsistent with the actual). If it is not matched properly, it may affect the stability of notebook operation and even more serious consequences.

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How Does QFN Package Solve the Heat Dissipation Problem of LED Display Screen
QFN package (quad flat no leads) - QFN is the name specified by Japan Electronic Machinery Industry Association (JEDEC).Four side pinless flat package, one of the surface mount packages, is a new surface mount chip packaging technology with pad at the bottom, small size, small volume and plastic as sealing material. Because QFN package does not have gull wing lead like traditional SOIC package, and the conductive path between internal pin and pad is short, self inductance? S number and package body? How long does it last? Therefore, it can provide excellent electrical performance, and because there is no gull wing lead, it can reduce the so-called antenna effect and reduce the overall electromagnetic interference (EMC / EMI). In addition, it also provides excellent heat dissipation through the exposed lead frame pad, which has a direct heat dissipation channel to release the heat of the chip in the package. Usually, the heat dissipation pad is directly welded on the circuit board, and the heat dissipation via in the PCB helps to diffuse the power consumption of the multi harrier into the copper grounding plate, so as to absorb the heat of the multi harrier; It can also achieve better land sharing effect. At present, QFN package has been widely used in general mobile phones and laptops, but it is about to flourish in LED display.Comparison of heat dissipation, size and volume between QFN and SOPGenerally, the size of SOP used is 104 mm2 (8x13x1.9mm), while the relative size of QFN is only 16mm2 (4x4x0.9mm), which is only 6 7 times the size of SOP; It has greater flexibility in the design of some small spacing display screens.Thermal resistance Ja) the coefficient is SOP = 59 / W, QFN = 39 / W, that is, the temperature from the chip node to the surface at the power of one watt. The following is the calculation formula of thermal resistance commonly used in the industry:TJ= ja*PDTaTJ= jc*PDTc Ja= jc* caSymbols and units used in the formula TJ C: node (chip) temperature Tc C: actual temperature Ta C: ambient temperature PD W: power supply voltage JA ( C / W): heat transfer impedance from actual to external surface JC ( C / W): heat transfer impedance from node to actual Ca ( C / W): heat transfer impedance from actual to external surfaceIn other words, if the same return temperature and power consumption, the node temperature on the chip will be different due to different packages. For example: if the ambient temperature is 85 C and the power consumption of the chip is 0.5W, the temperatures of SOP and QFN are as follows:Design of lamp drive in oneDue to the two characteristics of small volume and good heat dissipation of QFN, in the past, the specifications below pitch 16mm of outdoor display screen will choose the design of lamp drive separation because of the limitation of PCB board size routing and heat dissipation; That is, the LED light board and the driver chip board are placed on two to three different PCB boards respectively, and then connected with each other through connectors and cables. Although this design can solve the heat dissipation problem, the inductive effect generated through the connectors and wires may greatly reduce the color resolution of the display screen, and the inductive effect will also increase the chance of electromagnetic interference. When using QFN design; Because of its small size and no heat dissipation problem, the chip can be placed in the gap of the LED lamp. Therefore, it does not need to use more PCB boards and transmission lines. It is simpler in design and its cost can be reduced. Similarly, if the QFN design is used for the indoor display screen, the heat dissipation problem can also be greatly improved.
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